Product Overview

**Anodized Aluminum Heat Spreader:** Premium solid aluminum shell drawing heat away rapidly from internal memory chip packages.
**Intel XMP 2.0 Profile Ready:** Integrated custom profile structures allowing automated safe overclocking tuning with single click triggers.
**Low Profile Compact Height:** Space saving height profile engineering fitting under extra-large dual fan CPU air cooling blocks.
**High Performance PCB Engineering:** Custom eight layer performance PCB layout designed to handle high frequency signal strains.

Corsair Vengeance LPX 16GB (1x16GB) DDR4 3200MHz CL16 Desktop RAM

Name: Corsair Vengeance LPX 16GB (1x16GB) DDR4 3200MHz CL16 Desktop RAM
SKU: NM-135
Price: 2990.00 INR
Availability: InStock

SKU: NM-135

Market Price:~~₹6,500~~

Minimum Order Quantity:10 Units Min

Condition:New

Availability: IN STOCK (Ready to Dispatch)

Wholesale Price: ₹2,990

Technical Summary

Component Type

Performance Desktop RAM

Capacity

16GB Single Module

Memory Generation

DDR4

Frequency Clock

3200 MHz

Latency Timings

CL16 (16-20-20-38)

Voltage Profile

1.35V XMP Profile active

Specifications

Product Details

XMP PROFILES

Intel XMP Support	Version 2.0 certified
Overclocking Speed	3200MHz at 1.35V operational

PCB LAYOUT

Layer Count

8-Layer high density performance printing circuit board

Warranty & Brand

Warranty Description	Limited Lifetime Warranty Cover via Corsair India
ASIN	B07B4F9MCW

Product FAQs

What creates the low profile height advantage of this series?

The compact heat shield wraps tightly around internal chips adding zero extra height overheads

Can this module work smoothly on AMD Ryzen desktop motherboards?

Yes it passes intensive validation checkpoints matching major AMD AM4 motherboard platforms

Is it possible to scale system RAM capacities by adding another stick?

Yes matching identical modules triggers stable dual channel multi task operations layouts

What wholesale shipping protection applies?

Enclosed inside individual clear clamshell blisters grouped within thick outer packaging walls

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